Titanium sputtering targets are the key materials in physical vapor deposition (PVD) technology, particularly in the process of sputtering coating. They are made from titanium raw materials, and are widely used in high-tech industries such as electronics, information technology, decorative fields, and automotive glass manufacturing. In these applications, titanium targets are specifically applied in coating in integrated circuits, surface coating of flat panel display panels, or as coating layers for decorative and functional glass.
The core performance requirements of titanium sputtering targets
The performance of titanium target materials directly determines the quality of the deposited films and the performance of the final devices.
Purity: Purity is one of the most critical performance indicators of the target material, and it significantly affects the performance of the films. The requirements for purity vary greatly depending on different applications. The trend in chip manufacturing is that the silicon wafers are getting larger and the circuit lines are getting thinner. The size of the silicon wafers has been upgraded to 12 inches, and the width of the wiring has gradually decreased to 0.25 μm, 0.18 μm, and 0.13 μm. Therefore, the purity requirements for the core material, titanium target material, have become increasingly strict. For the 0.35 μm process, a target material with a purity of 99.995% is required, and for the 0.18 μm process, a target material with a purity of 99.999% or even ultra-high purity is necessary.
Impurity content: Impurities in the solid of the target material and the oxygen and water vapor adsorbed in the internal pores are the main sources of contamination for the deposited films. Different applications have extremely strict limits on specific impurity contents. For example, pure aluminum and aluminum alloys used in the semiconductor industry have extremely strict special requirements for alkali metal content and radioactive element content.
Density: High density is crucial for reducing internal pores in the target material and improving the performance of the sputtered films. The density of the target material not only affects the sputtering rate but also significantly influences the electrical properties (such as resistivity) and optical properties of the films. Generally speaking, the higher the density, the better the film performance. At the same time, high density and high strength can also enable the target material to better withstand the thermal stress during the sputtering process, reducing the risk of cracking. Therefore, density is a key performance indicator for measuring the quality of the target material.
The grain size and distribution: The grain size of the target material ranges from micrometers to millimeters. The sputtering efficiency of fine-grain targets is superior to that of coarse-grain targets. Target materials with uniform grain size are more likely to produce uniformly thick deposited films, which is a key performance guarantee for large-area flat panel display coating processes.
Applications of Titanium Target Materials
Semiconductor Industry: Titanium target materials can be used to manufacture electronic components, such as photodiodes, phototransistors, photoreceivers and transmitters, etc.
Optoelectronic Field: Titanium target materials can be used to manufacture optoelectronic devices, such as LEDs and solar cells, etc.
Magnetic Materials Field: Titanium target materials can be used to manufacture hard disks and magnetic cards, etc.
Other High-tech Fields: Titanium target materials are also widely used in high-temperature alloys, conductive materials, chemical catalysts, and medical equipment, etc.
These fields not only require materials with high strength and corrosion resistance, but also stable chemical properties and biocompatibility. Titanium target materials precisely meet these requirements and have become an important material in these fields.
Baoji Yibaite New Materials Technology Co., Ltd- titanium target materials supplier in Baoji, China